Resins & Oligomers

Resins and Oligomers

Silicone Resins

Silicone resins are high-performance materials known for their thermal resistance, weather durability, water repellency, and excellent dielectric properties. Built primarily on a siloxane (Si–O–Si) backbone, these resins offer remarkable UV and heat stability, making them ideal for demanding environments.

Silsource provides a diverse portfolio of Methyl Silicone Resins, Organic-Modified Resins, and Methyl/Phenyl Silicone Resins. These resins are typically made from T-units that form rigid three-dimensional networks upon curing. D-unit based formulations offer flexibility, while Q-units result in harder films. Compared to organic resins, silicone resins provide enhanced flame retardancy, electrical insulation, chemical resistance, adhesion, and overall mechanical stability.

Two curing systems are available: Condensation (dehydration) systems, typically single-component, and Hydrosilylation (addition-reaction) systems, known for fast curing and minimal shrinkage. These systems allow for customized performance depending on the final application.

Silicone Oligomers

Silicone oligomers are low molecular weight materials with a 3D structure and functional groups such as methyl, phenyl, alkoxysilyl, and other reactive moieties. These oligomers are highly versatile, offering low volatility, multiple reaction sites, and excellent compatibility with organic resins. They can be used as resin modifiers or standalone coatings, with the ability to cure at room temperature while providing strong hardness and water repellency.

Silsource offers three primary categories of silicone oligomers:

• Group A: These alkoxysilyl-based oligomers may contain methyl or methyl/phenyl groups. Methyl Group A types hydrolyze easily and are suitable for moisture-cured coatings that form hard, water-repellent films. Methyl/Phenyl variants provide greater compatibility with organic resins, making them ideal as diluents or flexibility enhancers.
• Group AR: Contain both reactive organic functional groups and alkoxysilyl groups, enabling improved adhesion between organic and inorganic substrates.
• Group R: These epoxy-functional oligomers cure via acid anhydride, photo-cationic, or thermal-cationic systems. Group R types deliver superior heat resistance and low shrinkage during curing, making them ideal for advanced coating and adhesive systems.